Model TPR–HD

Doubling Probe Card lifetime, forming and refreshing of probes tips – fastest pay back = Your intelligent way to save costs for wafer test!

Maintaining Good Contacts

• for cantilever, vertical and lithographic probe cards
• probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Palladium Alloys
• reshaping method based on specifically formulated abrasive elastomer pad
• highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
• very good contact resistance after reshaping
• maintains probecard alignment integrity, no realignment due to reshaping process necessary
• fully automatic, no specific operator skills required
• short process times