Research & Development:

In-house expertise and combination of applied physics, electronic design, micro-mechanics and numerical simulation allows us to develop integrated test concepts for most demanding applications, as sensors stimulation in wafer test, arcing suppression in high voltage probing and safe handling of highest test currents. Our test solutions apply to testing products for newest developments as autonomous driving, electromobility and advanced sensing.

Challenge us for more...!

• Wafer-probe interaction
• Electro-thermal and mechanical simulation of micro contacts
• Magnetic field applications for wafer and package test
• Optical stimulation on wafer level
• MEMS test
• High voltage and high current test setups
• Test lab verification and demo capabilities

Engineering

Electronics, mechanics and micro-contacts engineering capabilities allow for tailored solutions:

• Prober docking solutions
• Pogo towers
• Hot and cold temperature management for wafer test
• docking solutions
• Test sockets
• PRVx motherboards
• and many more!