Probe Cards
Integrated design of PCBs, mechanical components and additional functionalities on probe cards: The One Stop Shop
Contact technologies
Available for single and multi-site testing.
State-of-the-Art buckling beam vertical probe card technology, seamlessly integrated into PCB design and additional features, e.g. light sources, hot test, RF and high current capabilities.
New probe material
RzBeams provide excellent contact resistance stability for probing on Cu-pads and very high test currents (CCC) per probe.
Advanced cantilever probe geometries and materials allow for tailored solutions and stringent requirements: power device probing, ultra-stable CRES, low force, small pads…
Our probe card products
Power device probing
The Next Generation of High-Power Semiconductor Test
Our proprietary LuPo® Gen.4 and SmartClamp technologies set new benchmarks for safe, scalable, and reliable testing of power devices up to 15 kV and beyond 1000 A.
Designed for high-power Si, SiC and GaN devices, our solutions support applications from early-stage R&D to high-volume production testing.
Built for maximum performance and extreme conditions, T.I.P.S. probe cards support both wafer-level probing and Known Good Die (KGD) testing, with optional high-temperature capabilities up to 200 °C and high-parallelism available upon request.
Sensor probing
We ensure a cost-efficient and scalable testing processes for sensors empowering the ever-growing demands of IoT applications, smart homes, autonomous driving, and many more …
T.I.P.S. addresses these challenges by developing probe cards that seamlessly integrate these additional functionalities into a single, advanced testing solution. These probe cards enable high-precision sensor testing directly at the wafer level, making them fully compatible with standard high-volume industrial test setups using off-the-shelf probers and testers.
Beyond traditional probe cards for wafer testing, comprehensive sensor testing at the wafer level demands specialized stimuli to ensure precise and reliable results. This includes:
01. Magnetic fields
Integration of magnetic stimuli (vertical-, horizontal-, 3D-magnetic field configurations) into various probe card platforms allows for high precision wafer level test and calibration of magnetic sensor devices.
Our probe card solutions support both testing in lab environments as well as multi-site, high volume production wafer sort.
02. Pressure applications
TIPS LuPo® Technology enables wafer-level probing of MEMS pressure sensors used e. g. in medical applications, car tire pressure sensors and many more.
03. MEMS devices
Wafer tests of MEMS devices often involve dealing with very low electrical capacitance values, ultra-low leakage requirements and sometimes optical readout of mechanical motion in microscopic structures.
T.I.P.S‘ integrated approach copes with these requirements – from fully guarded PCB designs and probe card layouts to laser deflection measurements of microscopic MEMS structures integrated into probe cards for wafer test.
04. Other stimuli
- Gas (Additional: gas supply scanner box)
- Light fields
- Radiation (X-ray)
- Humidity applications
For more information about these sensor probe cards, please reach out.
Automotive ASICs
These applications are often characterized by a combination of logic circuitry and power outputs sharing the same die. The requirements for wafer test are challenging high density, fine pitch bond pads for the logic part in combination with hefty currents to be tested going up to several Amps.
The temperature range of our probe cards from – 60 °C to 200 °C allows to cope with the stringent test requirements of ICs for the automotive industry.
For requirements as contacting over active area (POAA) T.I.P.S. can provide contact geometries that minimize scrub length and pad damage yet maintain excellent contact properties.
TIPS’ Vertical Probe Card Technology is tailored for these stringent requirements: pulsed high-current signals, high signal integrity, fast signal paths integration.
Automotive RADAR
Challenges of highest test frequencies, multi-site measurements and high-volume mass production requirements can be addressed with T.I.P.S’ in-depth expertise in high frequency mixed signal vertical cards.
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We are your partner you can rely on. With a deep understanding of our customers’ needs for highest quality, reliability and on-time availability of test hardware.