Products & Services
T.I.P.S. Probe Refresher
- doubling probecard lifetime
- forming and refreshing of probes tips – pay back just in a few days = Your intelligent way to save costs for wafer test!
Features:
- suitable for cantilever probecards: probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Paliney
- cleaning/reshaping for vertical vertical buckling beam or Cobra style vertical probe cards
- option for lithographic probe cards available
- reshaping method based on specifically formulated abrasive elastomer pad
- highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
- very good contact resistance after reshaping
- maintains probecard alignment integrity, no realignment due to reshaping process necessary
- fully automatic, no specific operator skills required
- short process times: 1 to 60 minutes
![]() |
... probes from test floor |
|
![]() |
... cleaned and reshaped! |
|
![]() |
Picture of grinding head |
For detailed information download: TPR-HD flyer (pdf, ca. 440 kB)