Products & Services

T.I.P.S. Probe Refresher

  • doubling probecard lifetime
  • forming and refreshing of probes tips – pay back just in a few days = Your intelligent way to save costs for wafer test!

Features:

  • suitable for cantilever probecards: probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Paliney
  • cleaning/reshaping for vertical vertical buckling beam or Cobra style vertical probe cards
  • option for lithographic probe cards available
  • reshaping method based on specifically formulated abrasive elastomer pad
  • highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
  • very good contact resistance after reshaping
  • maintains probecard alignment integrity, no realignment due to reshaping process necessary
  • fully automatic, no specific operator skills required
  • short process times: 1 to 60 minutes

 

... probes from test floor  

... probes from test floor

     
... cleaned and reshaped!  

... cleaned and reshaped!

     
Picture of grinding head  

Picture of grinding head

 

For detailed information download: TPR-HD flyer (pdf, ca. 440 kB)


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